Syringe Tin Solder Paste

Features

• SMART DESIGN

New technical support, unique chemical formula provides excellent wetting, to ensure high reliability.Adapted to the mobile phone repair industry, computer digital service industries and high-presicion circuit board soldering SMT/BGA soldering processes.

• PCB/BGA DEDICATED

High-end quality, a unique formula, perfect performance, easy to weld, solder joint is bright and full, no weld, false welding phenomenon.

• WIDELY APPLICABLE

The residue is colorless and transparent, does not affect t he detection, disposable and excellent cleaning performance. Use of efficient energy thixotropic agents, printing and preheating collapse, special solder ensure a good printing and fine pattern.

• REVOLUTIONARY DURABILITY

Wetting, anti-dry, relatively long shelf life at room temperature. Unique high-quality solder paste, fine and flexible packaging (10 cc/support), delicate appearance.

Preservation method:

• The solder paste should be kept at 1-10℃.
• Before the opening, the temperature of the solder paste should be raised to the ambient temperature (25℃), and the temperature return time should be about 3-4 hours.
• The solder paste should be used for 6 months.
• The solder paste should not be placed in the sun.

Precautions:

• Use only with adequate Ventilation.
• The solder paste contains organic solvent. Avoid repeated contact with skin. If the solder paste gets on your skin, wipe it off with alcohol and rinse thoroughly with water.
• Avoid contacting with eyes.
• Keep away from children.

Specifications:

• Volume: 10 ml
• Size: 4.13*1.38 inch
• Working Temperature: 240℃

Package includes:

• 1 * BGA Syringe Tin Solder Paste